SACHEM TO DELIVER TECHNICAL PAPER AT SEMATECH SURFACE PREPARATION CONFERENCE

SACHEM announced today that it will deliver a technical paper focused on meeting advanced contact clean selectivity requirements with single wafer tools.

Austin, TX – April 9, 2007 –  SACHEM, Inc. announced today that it will deliver a technical paper at the SEMATECH 2007 Surface Preparation and Cleaning Conference.  This conference will focus on the needs and challenges in wafer and mask cleaning, including wafer front-end, wafer back-end, advanced mask, and environment, safety and health issues.  SACHEM’s paper, delivered by Russell Stevens, Applications Development Manager, and its exhibit are centered around its core Front End of Line (FEOL) wet etch and clean selectivity technology.  The conference is scheduled for Wednesday and Thursday, April 25-26, 2007 in Austin, Texas.

SACHEM’s research and products are highly focused on achieving precisely controlled selectivity in FEOL wet etch and clean applications.  The introduction of new materials, reduced thermal budgets and increasingly complex integrations have challenged the performance of traditional FEOL chemistries.  The company’s recognition of the complex interaction of tool parameters and chemistry led to the investigation of the effect of single wafer tool parameters on etch selectivity for an advanced contact clean application.  The high aspect ratios found in advanced contacts require not only careful chemical design, but a full understanding of the physical process effects of the chemical selectivity on the wafer

As a sponsor of the Surface Preparation and Cleaning Conference, SACHEM will also feature the new product, SelectEtchTM SE-1220, representing a significant improvement in high-aspect-ratio contact clean performance.  SelectEtchTM SE-1220 successfully removes etch-generated residues from the bottom and sides of advanced contact features.  SE-1220’s chemical design and functionality allow it to remove residues while achieving outstanding surface roughness and maintaining critical dimensions, especially in complex film stacks.

Dr. Richard Goodin, Technology Vice President of SACHEM, Inc., commented, “Tall, narrow features with multiple films are especially challenging with regard to chemical design in cleaning technology.  Our fundamental understanding of chemical science, paired with precisely controlled physical processes, is leading to increased process performance for our customers and development partners.”

SACHEM, Inc. delivers highly pure, precise and innovative chemical solutions designed to solve the most demanding and challenging applications.  For over 50 years SACHEM has provided chemical solutions and services to customers in key markets including  electronics, biotechnology, starch modification, polymers, catalysts, pharmaceutical and agricultural chemicals.  Based in Austin, Texas, SACHEM’s expanding worldwide operations include manufacturing and research facilities in North America, Europe and Asia with a global service network and presence spanning over 30 countries.