{"id":15750,"date":"2014-05-29T11:12:41","date_gmt":"2014-05-29T16:12:41","guid":{"rendered":"http:\/\/sacheminc.com\/wet-silicon-etch-process-tsv-reveal-paper-2\/"},"modified":"2014-07-01T14:46:33","modified_gmt":"2014-07-01T19:46:33","slug":"wet-silicon-etch-process-tsv-reveal-paper","status":"publish","type":"page","link":"https:\/\/www.sacheminc.com\/ko\/%ec%a0%9c%ed%92%88\/%eb%b6%80%ec%8b%9d%ec%95%a1-%eb%b0%8f-%ec%84%b8%ec%a0%95%ec%95%a1\/wet-silicon-etch-process-tsv-reveal-paper\/","title":{"rendered":"Wet Silicon Etch Process for TSV Reveal | Technical Paper Request"},"content":{"rendered":"<p>Authors:\u00a0Laura B. Mauer, John Taddei, Ramey Youssef |\u00a0Solid State Equipment, LLC<br \/>\nYongqiang Lu, Sian Collins, Kevin McLaughlin, Craig Allen |\u00a0SACHEM, Inc.<\/p>\n<p><strong>Abstract:<\/strong> \u00a0This paper presents a wet process as a simple and cost-effective alternative to the polish\/plasma etch TSV reveal process. By combining silicon thickness measurement, wet etch, and cleaning in a single-wafer process system, this platform provides a low cost-of-ownership solution for TSV reveal. The process uses a wet etch chemistry with a fast etch rate and high selectivity, in a single-wafer process tool. The new selective etch chemistry improves the etch rate by 50% or more over traditional Si etchants currently used in the industry, such as tetramethylammonium hydroxide (TMAH). This new etch chemistry also has high silicon-etch selectivity over the oxide liner and Cu, with etch rate (ER) ratios greater than 10,000 and 1000, respectively. TMAH is not a component in the chosen chemistry because of safety concerns specifically related to TMAH toxicity.<\/p>\n<p>Please fill out the form below and you will receive an email with a link to download the full technical paper:<\/p>\n<p><iframe loading=\"lazy\" style=\"border: 0;\" src=\"http:\/\/info.sacheminc.com\/l\/33012\/2014-05-29\/q9qc\" width=\"100%\" height=\"300\" frameborder=\"0\"><\/iframe><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Authors:\u00a0Laura B. Mauer, John Taddei, Ramey Youssef |\u00a0Solid State Equipment, LLC Yongqiang Lu, Sian Collins, Kevin McLaughlin, Craig Allen |\u00a0SACHEM, Inc. Abstract: \u00a0This paper presents a wet process as a simple and cost-effective alternative to the polish\/plasma etch TSV reveal process. By combining silicon thickness measurement, wet etch, and cleaning in a single-wafer process system, &hellip;<\/p>\n","protected":false},"author":43,"featured_media":15698,"parent":9880,"menu_order":0,"comment_status":"closed","ping_status":"open","template":"","meta":{"footnotes":""},"class_list":["post-15750","page","type-page","status-publish","has-post-thumbnail","hentry","has-thumb"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.sacheminc.com\/ko\/wp-json\/wp\/v2\/pages\/15750","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sacheminc.com\/ko\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.sacheminc.com\/ko\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.sacheminc.com\/ko\/wp-json\/wp\/v2\/users\/43"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sacheminc.com\/ko\/wp-json\/wp\/v2\/comments?post=15750"}],"version-history":[{"count":0,"href":"https:\/\/www.sacheminc.com\/ko\/wp-json\/wp\/v2\/pages\/15750\/revisions"}],"up":[{"embeddable":true,"href":"https:\/\/www.sacheminc.com\/ko\/wp-json\/wp\/v2\/pages\/9880"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sacheminc.com\/ko\/wp-json\/wp\/v2\/media\/15698"}],"wp:attachment":[{"href":"https:\/\/www.sacheminc.com\/ko\/wp-json\/wp\/v2\/media?parent=15750"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}