NEWS
SACHEM Launches Endura CS™, its Portfolio of Clay Control Agents for Oilfield Print E-mail

Austin, TX – February 2, 2012 – SACHEM launches Endura CS™ and Endura CSG™, a line of clay control agents for oilfield and fracing applications. Compared with KCl, SACHEM Endura CS™ can save a customer up to 75% cost, is much less corrosive, easier to use and available globally through out network of distributors and production facilities spanning over thirty countries.

 
SACHEM to Exhibit at SEMATECH Surface Preparation and Cleaning Conference, March 17-19, 2011 in Austin, TX Print E-mail

Austin, TX – January 10, 2011 – SACHEM will exhibit at SEMATECH Surface Preparation and Cleaning Conference (SPCC), March 17-19, 2012 in Austin, Texas. SPCC brings together researchers from the semiconductor industry and the academic community to focus on current developments challenges in advanced wafer and mask cleaning and surface preparation technologies.

 
SACHEM Exhibits at SEMICON Korea; Update on TMAH Safety and Envure System™ Alternatives to TMAH Print E-mail

Seoul, Korea – January 6, 2011 – SACHEM will be exhibiting at SEMICON Korea 2012, February 7-9 in Seoul, Korea. SACHEM experts will  be available to provide an update on TMAH Safety and the Envure System™, a platform of TMAH alternatives and next generation electronic formulation components for complex cleaning, etching or stripping applications.

 
SACHEM to Exhibit at SEMICON Japan 2011 – Highlighting Envure System™ Next Generation Electronic Performance Products Print E-mail

Austin, TX – December 5, 2011 – SACHEM will be exhibiting at SEMICON Japan 2011, December 7-9 in Chiba, Japan. SACHEM’s feature offering this year is the Envure System™, an exciting platform of next generation electronic formulation components for complex cleaning, etching or stripping applications. 

 
SACHEM expands its Envure System for Semiconductor cleaning, etching and stripping applications Print E-mail

Austin, TX – October 25, 2011 – SACHEM complements its Envure System™ portfolio of products and services for integrated circuit – cleaning, etching, and stripping applications with four product lines:

  • Envure™ SE          Line of silicon etch products and components
  • Envure™ ST          Line of Stripper products and components
  • Envure™ DV         Line of developer components
  • Envure™ CL          Line of products used in CMP and clean applications
 
"Isolation and Characterization of Therapeutic Antibody Charge Variants Using Cation Exchange Displacement Chromatography” - Paper Published in Journal of Chromatography, Aug 2011 Issue Print E-mail

Austin, TX – August 23, 2011 – Using SACHEM’s Expell ™ SP1 displacer, scientists successfully achieve the isolation and enrichment of highly pure charge variants (>90%) from a 200mg mAb sample in a single displacement chromatography run.

 
SACHEM and Avantor™ Announce Agreement to Develop New Selective Etch Materials for Global Semiconductor Market Print E-mail
Austin, Texas & Phillipsburg, New Jersey – July 6, 2011 – Companies to combine resources and drive commercialization of groundbreaking customized selective etch chemistries  
 
SACHEM Announces a Price Increase of 10% on the Supply of Tetramethylammonium Chloride, Effective August 1, 2011 Print E-mail

Austin, Texas – June 28, 2011 -- SACHEM announces a price increase of 10% on the supply of Tetramethylammonium Chloride (TMAC) effective August 1, 2011. The price increase is necessary due to continued increases in energy, logistics, and raw materials costs.

 
SACHEM to Present “Commercializing Structure Directing Agents” at FEZA 2011 Conference Print E-mail

Austin, TX – June 17, 2011 -- SACHEM will present: “Commercializing Structure Directing Agents - Practical Guidelines and Capabilities for Industry” at FEZA 2011 on Monday, July 4 at 13:00 (Valencia Congress Center Auditorium). With the trend towards larger zeolites, SACHEM will discuss unique capabilities to supply correspondingly larger and more exotic templates.

 
SACHEM Implements 10% Price Adjustment for TBAH, TEAH, TPAH and Respective Derivatives Effective July 18, 2011 Print E-mail

Austin, Texas – June 17, 2011 - The adjustment is a result of significant price increases in the petroleum raw material based industry. SACHEM has been working diligently to control these costs.

 
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