SACHEM's has created a line of specialty etchants for FEOL applications where selectivity performance, precision and purity combine as exacting requirements.  We provide solutions for selective etching challenges driven by new processes and materials in Front End device manufacturing. 

Applications include

• New gate metals
• New high-k oxide compatibility requirements
• Removal of unreacted metals in advanced Silicide applications
• Planar-selective etching of silicon to create precise source-drain recess geometries in P-MOS strain applications

We can solve your challenging selective metal and silicon etch challenges with innovative products.