SACHEM SelectEtch 1400™ series delivers selective etching across crystal planes, minimized surface roughness, and controllable etch rates.

SACHEM’s SelectEtch™ SE-1430 is a new technology in the area of planar-selective wet
etching of silicon. To learn more about the background of silicon crystalline planes and the performance characteristics of standard etchants, take a look:

Silicon Etching in Microelectronics: A General Overview

SACHEM SelectEtch 1400™ series delivers

• Selective Etching across crystal planes
• Minimized surface roughness
• Controllable etch rates

pMOS Channel Strain Application
The combination of correctly defined recess structures and SiGe deposition in the source & drain areas can increase channel strain by as much as 100%.  Definition of the <1,1,1> facets facilitate the application of channel strain.  For every 1% increase in strain, a 10-20% improvement in I_ON can result.

SACHEM SelectEtch SE-1430™
SACHEM has developed a proprietary etchant with 
Improved planar etch selectivity
Decreased surface roughness
Improved process control through lower, controllable etch rates


Note the distinct angles between the interfaces and the smooth bottom and sidewalls of the structures.