SelectEtch™ FRONT END OF LINE (FEOL) SELECTIVE ETCHANTS & CLEANERS

INDUSTRIES

SelectEtch™ Selective Front End of Line (FEOL) Oxide Etchants

SACHEM SelectEtch™SE-1100 series is the key for fast removal of thermal and doped oxides, consistent wet oxide etch rates with time to avoid over-etch, minimal attach on SiN and TiN films and good compatibility with polysilicon.

SelectEtch™ Front End of Line (FEOL) Advanced Contact Cleaners

SACHEM SelectEtch™ SE-1200 Series has cleaner contacts with minimal critical dimension variation, higher or equivalent activity on thermal oxides vs. doped or low density oxides, and more precise control through lower overall etch rates.

SelectEtch™ Selective Front End of Line (FEOL) Metal Etchants

SACHEM SelectEtch™ SE-1300 series selectively etch new materials such as Ruthenium and Nickel Platinum.

SelectEtch™Selective Front End of Line (FEOL) Silicon Etchants

SACHEM SelectEtch 1400™ series delivers selective etching across crystal planes, minimized surface roughness, and controllable etch rates.

SelectEtch™ FRONT END OF LINE (FEOL) SELECTIVE ETCHANTS & CLEANERS

Are standard chemistries such as dilute Hydrofluoric Acid (dHF) and Buffered Oxide Etch (BOE) going to meet your FEOL surface preparation needs for advanced devices?

We don't think so.

New materials and devices are completely overwhelming the capability of standard chemistries. dHF and BOE methods can't take advantage of single wafer processing technology.

Let Us Prove It To You:

Our specialty raw material synthesis is unique and can solve complex FEOL Surface Preparation problems
We can manufacture and deliver integrated solutions with the Purity and Precision required in the FEOL
We have a solid understanding of the relationship between performance and the chemical science behind the components

SACHEM is your leading provider of Chemical Solutions for Front End Of Line Single Wafer Cleaning and Surface Preparation Applications.