Chemical Mechanical Planarization (CMP)

Chemical Mechanical Planarization or Polishing (CMP) requires high purity and precise chemistry before additional processing can occur. SACHEM can help with products such as

Take a look at the publication below for details on how tetrapropylammonium hydroxides and other tetraalkylammonium hydroxides can improve post Chemical Mechanical Planarization (CMP) Cleaning.

Publication
"Performance Evaluation of Cleaning Solutions Enhanced with Tetraalkylammonium Hydroxide Substituents for Post-CMP Cleaning on Poly-Si Film"

J. Electrochem. Soc., Volume 149, Issue 6, pp. G336-G342 (June 2002)

Tung Ming Pan, Tan Fu Lei, Fu Hsiang Ko, Tian Sheng Chao, Ming Chi Liaw, Ying Hao Lee, and Ching Peng Lu