
| SACHEM to Showcase New SelectEtch™ Products at SEMATECH's SPCC |
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(Austin, TX) - March 19, 2008 - SACHEM announced today that it will participate in the SEMATECH Surface Preparation and Cleaning Conference (SPCC) as a sponsor, showcasing new products and capabilities in FEOL selective etching and cleaning. The conference will focus on the needs and challenges in wafer and mask cleaning, including wafer front-end, wafer back-end, advanced mask, and environment, safety and health issues. The conference is scheduled for Tuesday and Wednesday April 1st and 2nd in Austin, Texas. SACHEM's SelectEtch™ SE-1430 will be a featured product and is a proprietary etchant with improved planar etch selectivity. This product produces decreased surface roughness and improves process control through lower, controllable etch rates. Russell Stevens, SACHEM's Manager of New Business Development for Electronic Materials, will present a poster on the capabilities of existing etchants, as well as SACHEM's new SelectEtch™ SE-1430 silicon etchant. The new SE-1430 etchant offers a significant increase over Potassium Hydroxide in the selectivity between crystal planes. SACHEM's SelectEtch™ SE-1310 will be another featured product. SelectEtch™ SE-1310 is designed for selective removal of Ruthenium metal, especially in FEOL metal gate applications and BEOL Cu barrier layer applications. Other posters to be presented include Select-Etch™ Selective Front End of Line (FEOL) Oxide Etchants and Particle Removal.
SACHEM's research and products are highly focused on achieving precisely controlled selectivity in FEOL wet etch and clean applications. The introduction of new materials, reduced thermal budgets and increasingly complex integrations have challenged the performance of traditional FEOL chemistries. The company's recognition of the complex interaction of tool parameters and chemistry led to the investigation of the effect of single wafer tool parameters on etch selectivity for a variety of advanced FEOL applications. |
