SelectEtch™ Front End of Line (FEOL) Advanced Contact Cleaners

SACHEM SelectEtch™ SE-1200 Series has

  • Cleaner contacts with minimal critical dimension variation
  • Higher or equivalent activity on thermal oxides vs. doped or low density oxides
  • More precise control through lower overall etch rates
se1220 graph
SelectEtch™ SE-1220 delivers consistent etch rates on a variety of oxides, removing the etch-generated oxide at the contact bottom without damage to Critical Dimensions (CD) 
 

 

TOX

PSG

CVD-SiN

Poly

LP-TEOS

BPSG

BOE (30:1) @ RT

138.0

336.0

28.1

11.9

388.8

517.8

100:1 dHF @RT

16.7

359.7

15.5

17.4

183.2

185.1

SE-1220 @ 50C

12.8

19.3

1.8

24.4

23.6

18.0


Application: Remove high aspect ratio contact etch residues without critical dimension variation or damage to exposed films 
Critical Performance Measures:
          Etch doped and undoped films uniformlycontactfeatures
          Etch TOx faster that TEOS 
          Minimize etch on silicides or polysilicon
          Remove thermally grown oxides efficiently
          in single wafer tool processes


Available Products

SelectEtch™ SE-1220 Advanced Contact Cleaner

Advanced contact cleaner for high aspect ratio contacts.

Product Sheet [135 KB]  

SelectEtch™ SE-1230 Advanced Contact Cleaner

Advanced Contact Cleaner with reduced etch rates for additional control.

Resources Coming Soon.

SelectEtch™ SE-1240 Advanced Contact Cleaner

Advanced Contact Cleaner with improved SOD:ThOx non-selectivity.

Resources Coming Soon.